A $5.5 million investment more than doubles U.S. thermoelectric cooler production space, with over 5,300 sq. ft. dedicated to manufacturing and R&D to support growing demand across optoelectronics, sensor system and other high-growth markets. DURHAM, N.C., September 15, 2026 – […]

The IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) was held at the JW Marriott Grande Lakes, Orlando, FL, May 26–29, 2026. This was the 25th ITherm, which was first held in 1988. The conference was […]

Evaluating thermal management materials for modern electronic applications goes far beyond picking a product from a catalog. Recently, an electronics manufacturer operating in Vietnam engaged T-Global to navigate the entire evaluation process for a new device. The company needed support […]

As electronics manufacturing continues to expand across Vietnam and Southeast Asia, regional production teams are placing greater demands on suppliers to respond quickly, support customization, and maintain reliable delivery from development through mass production. For one electronics manufacturing customer operating […]

As direct-to-chip liquid cooling moves from pilot projects to larger AI and high-performance computing deployments, maintaining coolant health is becoming an increasingly important part of the thermal reliability equation. Beyond selecting a fluid with the right thermal properties, engineering teams […]

Introduction As single-component heat dissipations in electronics cooling are increasing, air cooling is not always up to the task and is being replaced by liquid cooling. Key differences between air cooling and liquid cooling are a much higher heat transfer […]